Jellesen, M.S.: search on Z-Library

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1

Thermal decomposition of solder flux activators under simulated wave soldering conditions

Piotrowska, Kamila, Jellesen, Morten Stendahl, Ambat, Rajan

Journal:

Soldering & Surface Mount Technology

Year:

2017

Language:

english

File:

PDF, 1.82 MB

english, 2017

2

Humidity build-up in electronic enclosures exposed to different geographical locations by RC modelling and reliability prediction

Conseil-Gudla, H., Staliulionis, Z., Mohanty, S., Jellesen, M.S., Hattel, J.H., Ambat, R.

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 2.33 MB

english, 2018

3

Contamination profile on typical printed circuit board assemblies vs soldering process

Conseil, Helene, Stendahl Jellesen, Morten, Ambat, Rajan

Journal:

Soldering & Surface Mount Technology

Year:

2014

Language:

english

File:

PDF, 570 KB

english, 2014

4

Effect of pulsed voltage on electrochemical migration of tin in electronics

Verdingovas, Vadimas, Jellesen, Morten Stendahl, Ambat, Rajan

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2015

Language:

english

File:

PDF, 2.27 MB

english, 2015

5

Relative effect of solder flux chemistry on the humidity related failures in electronics

Verdingovas, Vadimas, Jellesen, Morten Stendahl, Ambat, Rajan

Journal:

Soldering & Surface Mount Technology

Year:

2015

Language:

english

File:

PDF, 3.03 MB

english, 2015

6

Colorimetric visualization of tin corrosion: A method for early stage corrosion detection on printed circuit boards

Verdingovas, Vadimas, Jellesen, Morten Stendahl, Ambat, Rajan

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 3.78 MB

english, 2017

7

Investigation of moisture uptake into printed circuit board laminate and solder mask materials

Conseil-Gudla, Hélène, Gudla, Visweswara C., Borgaonkar, Shruti, Jellesen, Morten S., Ambat, Rajan

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2017

Language:

english

File:

PDF, 4.04 MB

english, 2017

8

Humidity Build-Up in a Typical Electronic Enclosure Exposed to Cycling Conditions and Effect on Corrosion Reliability

Conseil, Helene, Gudla, Visweswara Chakravarthy, Jellesen, Morten Stendahl, Ambat, Rajan

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2016

Language:

english

File:

PDF, 3.06 MB

english, 2016

9

Humidity Buildup in Electronic Enclosures Exposed to Constant Conditions

Conseil-Gudla, H., Staliulionis, Z., Jellesen, M. S., Jabbari, M., Hattel, J. H., Ambat, R.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2017

Language:

english

File:

PDF, 2.60 MB

english, 2017

10

Corrosion failure due to flux residues in an electronic add-on device

Morten S. Jellesen, Daniel Minzari, Umadevi Rathinavelu, Per Møller, Rajan Ambat

Journal:

Engineering Failure Analysis

Year:

2010

Language:

english

File:

PDF, 1.27 MB

english, 2010

11

[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Experimental study of water absorption of electronic components and internal local temperature and humidity into electronic enclosure

Conseil, Helene, Jellesen, Morten S., Ambat, Rajan

Year:

2014

Language:

english

File:

PDF, 507 KB

english, 2014

12

On the electrochemical migration mechanism of tin in electronics

Daniel Minzari, Morten S. Jellesen, Per Møller, Rajan Ambat

Journal:

Corrosion Science

Year:

2011

Language:

english

File:

PDF, 2.18 MB

english, 2011

13

Cobalt release and complications resulting from the use of dental prostheses

Al-Imam, Hiba, Benetti, Ana R., Özhayat, Esben B., Pedersen, Anne M. L., Johansen, Jeanne D., Thyssen, Jacob P., Jellesen, Morten S., Gotfredsen, Klaus

Journal:

Contact Dermatitis

Year:

2016

Language:

english

File:

PDF, 411 KB

english, 2016

14

Circuit analysis to predict humidity related failures in electronics - Methodology and recommendations

Joshy, Salil, Verdingovas, Vadimas, Jellesen, Morten Stendahl, Ambat, Rajan

Journal:

Microelectronics Reliability

Year:

2019

File:

PDF, 488 KB

2019

15

Decomposition of no-clean solder flux systems and their effects on the corrosion reliability of electronics

Conseil, Hélène, Verdingovas, Vadimas, Jellesen, Morten S., Ambat, Rajan

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2016

Language:

english

File:

PDF, 1.02 MB

english, 2016

16

[IEEE 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) - Oulu (2018.6.12-2018.6.14)] 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) - Water film formation on the PCBA surface and failure occurrence in electronics

Piotrowska, Kamila, Jellesen, Morten S., Ambat, Rajan

Year:

2018

Language:

english

File:

PDF, 392 KB

english, 2018

17

Solder Flux Residues and Humidity-Related Failures in Electronics: Relative Effects of Weak Organic Acids Used in No-Clean Flux Systems

Verdingovas, Vadimas, Jellesen, Morten Stendahl, Ambat, Rajan

Journal:

Journal of Electronic Materials

Year:

2015

Language:

english

File:

PDF, 5.18 MB

english, 2015

18

[IEEE 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL (2017.5.30-2017.6.2)] 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Effect of interior geometry on local climate inside an electronic device enclosure

Joshy, Salil, Jellesen, Morten, Ambat, Rajan

Year:

2017

File:

PDF, 349 KB

2017

19

Failure of total hip implants: metals and metal release in 52 cases

Jakobsen, Stig S., Lidén, Carola, Søballe, Kjeld, Johansen, Jeanne D., Menné, Torkil, Lundgren, Lennart, Bregnbak, David, Møller, Per, Jellesen, Morten S., Thyssen, Jacob P.

Journal:

Contact Dermatitis

Year:

2014

Language:

english

File:

PDF, 1.02 MB

english, 2014

20

Performance Comparison of Steam-Based and Chromate Conversion Coatings on Aluminum Alloy 6060

Din, Rameez Ud, Jellesen, Morten S., Ambat, Rajan

Journal:

Year:

2015

Language:

english

File:

PDF, 16.51 MB

english, 2015

21

Printed Circuit Board Surface Finish and Effects of Chloride Contamination, Electric Field, and Humidity on Corrosion Reliability

Conseil-Gudla, Hélène, Jellesen, Morten S., Ambat, Rajan

Journal:

Journal of Electronic Materials

Year:

2017

Language:

english

File:

PDF, 2.17 MB

english, 2017

22

Effect of Solder Mask Surface Chemistry and Morphology on the Water Layer Formation Under Humid Conditions

Piotrowska, Kamila, Din, Rameez Ud, Jellesen, Morten Stendahl, Ambat, Rajan

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2018

Language:

english

File:

PDF, 2.25 MB

english, 2018

23

[IEEE 2009 Annual Reliability and Maintainability Symposium (RAMS) - Fort Worth, TX, USA (2009.01.26-2009.01.29)] 2009 Annual Reliability and Maintainability Symposium - Effect of solder flux residues on corrosion of electronics

Hansen, Kirsten Stentoft, Jellesen, Morten S., Moller, Per, Westermann, Peter Jacob Schwencke, Ambat, Rajan

Year:

2009

Language:

english

File:

PDF, 700 KB

english, 2009

24

Impact of NaCl Contamination and Climatic Conditions on the Reliability of Printed Circuit Board Assemblies

Verdingovas, Vadimas, Jellesen, Morten Stendahl, Ambat, Rajan

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 2.11 MB

english, 2014

25

Effect of No-Clean Flux Residues on the Performance of Acrylic Conformal Coating in Aggressive Environments

Rathinavelu, U., Jellesen, M.S., Moller, P., Ambat, R.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2012

Language:

english

File:

PDF, 1.73 MB

english, 2012

26

Electrochemical Migration on Electronic Chip Resistors in Chloride Environments

Minzari, D., Jellesen, M.S., Moller, P., Wahlberg, P., Ambat, R.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2009

Language:

english

File:

PDF, 1.56 MB

english, 2009

27

Chromium(VI) release from leather and metals can be detected with a diphenylcarbazide spot test

Bregnbak, David, Johansen, Jeanne D., Jellesen, Morten S., Zachariae, Claus, Thyssen, Jacob P.

Journal:

Contact Dermatitis

Year:

2015

Language:

english

File:

PDF, 1014 KB

english, 2015

28

[IEEE 2019 Pan Pacific Microelectronics Symposium (Pan Pacific) - Kauai, HI, USA (2019.2.11-2019.2.14)] 2019 Pan Pacific Microelectronics Symposium (Pan Pacific) - Impact of Process-Related Flux Contamination on the Electronics Reliability Issues Under Detrimental Climatic Conditions

Piotrowska, Kamila, Lagana, Simone, Jellesen, Morten S., Ambat, Rajan

Year:

2019

Language:

english

File:

PDF, 34 KB

english, 2019

29

Nickel and Cobalt Release From Children’s Toys Purchased in Denmark and the United States

Jensen, Peter, Hamann, Dathan, Hamann, Carsten R., Jellesen, Morten S., Jacob, Sharon E., Thyssen, Jacob P.

Journal:

Year:

2014

Language:

english

File:

PDF, 180 KB

english, 2014

30

Maternal use of oral contraceptives and risk of fetal death

Rikke Jellesen, Katrine Strandberg-Larsen, Tina Jørgensen, Jørn Olsen, Ane M. Thulstrup, Anne-Marie N. Andersen

Journal:

Paediatric and Perinatal Epidemiology

Year:

2008

Language:

english

File:

PDF, 81 KB

english, 2008

31

A review of metal release in the food industry

M. S. Jellesen, A. A. Rasmussen, L. R. Hilbert

Journal:

Materials and Corrosion/Werkstoffe und Korrosion

Year:

2006

Language:

english

File:

PDF, 152 KB

english, 2006

32

Nickel may be released from laptop computers

Jensen, Peter, Jellesen, Morten S., Møller, Per, Johansen, Jeanne D., Lidén, Carola, Menné, Torkil, Thyssen, Jacob P.

Journal:

Contact Dermatitis

Year:

2012

Language:

english

File:

PDF, 453 KB

english, 2012

33

Accelerated growth of oxide film on aluminium alloys under steam: Part I: Effects of alloy chemistry and steam vapour pressure on microstructure

Din, Rameez Ud, Gudla, Visweswara C., Jellesen, Morten S., Ambat, Rajan

Journal:

Surface and Coatings Technology

Year:

2015

Language:

english

File:

PDF, 5.64 MB

english, 2015

34

Gaseous surface hardening of Ti-6Al-4V fabricated by selective laser melting

Valente, Emilie H., Jellesen, Morten S., Somers, Marcel A.J., Christiansen, Thomas L.

Journal:

Surface and Coatings Technology

Year:

2020

Language:

english

File:

PDF, 3.00 MB

english, 2020

35

A cobalt spot test was useful in the diagnostic work-up of a cobalt allergic patient suffering from oral hypersensitivity to cobalt

Jacob Pontoppidan Thyssen, Torkil Menné, Per Møller, Morten S. Jellesen, Jeanne Duus Johansen

Journal:

Journal of the American Academy of Dermatology

Year:

2011

Language:

english

File:

PDF, 606 KB

english, 2011

36

Accelerated growth of oxide film on aluminium alloys under steam: Part II: Effects of alloy chemistry and steam vapour pressure on corrosion and adhesion performance

Din, Rameez Ud, Bordo, Kirill, Jellesen, Morten S., Ambat, Rajan

Journal:

Surface and Coatings Technology

Year:

2015

Language:

english

File:

PDF, 3.42 MB

english, 2015

37

Cobalt release from implants and consumer items and characteristics of cobalt sensitized patients with dermatitis

Jacob P. Thyssen, Torkil Menné, Carola Lidén, Anneli Julander, Peter Jensen, Stig S. Jakobsen, Kjeld Søballe, Klaus Gotfredsen, Morten S. Jellesen, Jeanne D. Johansen

Journal:

Contact Dermatitis

Year:

2012

Language:

english

File:

PDF, 739 KB

english, 2012

38

ECS Transactions [ECS 216th ECS Meeting - Vienna, Austria (October 4 - October 9, 2009)] - Corrosion in Electronics at Device Level

Jellesen, Morten S., Minzari, Daniel, Rathinavelu, Umadevi, Mo̸ller, Per, Ambat, Rajan

Year:

2010

Language:

english

File:

PDF, 3.05 MB

english, 2010

39

Chromium(VI) release from leather and metals can be detected with a diphenylcarbazide spot test

Bregnbak, David, Johansen, Jeanne D., Jellesen, Morten S., Zachariae, Claus, Thyssen, Jacob P.

Journal:

Contact Dermatitis

Year:

2015

File:

PDF, 1014 KB

2015

40

Electrochemical migration of tin in electronics and microstructure of the dendrites

Daniel Minzari, Flemming Bjerg Grumsen, Morten S. Jellesen, Per Møller, Rajan Ambat

Journal:

Corrosion Science

Year:

2011

Language:

english

File:

PDF, 2.29 MB

english, 2011

41

[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Simulation of electronic circuit sensitivity towards humidity using electrochemical data on water layer

Joshy, Salil, Verdingovas, Vadimas, Jellesen, Morten, Ambat, Rajan

Year:

2015

Language:

english

File:

PDF, 179 KB

english, 2015

42

Morphological study of silver corrosion in highly aggressive sulfur environments

Daniel Minzari, Morten S. Jellesen, Per Møller, Rajan Ambat

Journal:

Engineering Failure Analysis

Year:

2011

Language:

english

File:

PDF, 1.99 MB

english, 2011

43

Effect of solder flux residue on the performance of silicone conformal coatings on printed circuit board assemblies

Rathinavelu, U., Jellesen, M. S., Ambat, R.

Journal:

Corrosion Engineering Science and Technology

Year:

2013

Language:

english

File:

PDF, 512 KB

english, 2013

44

Steam assisted oxide growth on aluminium alloys using oxidative chemistries: Part I Microstructural investigation

Din, Rameez Ud, Piotrowska, Kamila, Gudla, Visweswara Chakravarthy, Jellesen, Morten Stendahl, Ambat, Rajan

Journal:

Applied Surface Science

Year:

2015

Language:

english

File:

PDF, 13.87 MB

english, 2015

45

Cobalt spot test used for diagnosis of occupationally-related exposure to cobalt-containing powder

Jacob P. Thyssen, Jeanne D. Johansen, Morten S. Jellesen, Torkil Menné

Journal:

Contact Dermatitis

Year:

2012

Language:

english

File:

PDF, 512 KB

english, 2012

46

Steam assisted oxide growth on aluminium alloys using oxidative chemistries: Part II corrosion performance

Din, Rameez Ud, Jellesen, Morten Stendahl, Ambat, Rajan

Journal:

Applied Surface Science

Year:

2015

Language:

english

File:

PDF, 6.79 MB

english, 2015

47

Erosion–corrosion and corrosion properties of DLC coated low temperature gas-nitrided austenitic stainless steel

Morten S. Jellesen, Thomas L. Christiansen, Lisbeth Rischel Hilbert, Per Møller

Journal:

Year:

2009

Language:

english

File:

PDF, 989 KB

english, 2009

48

Assessment of nickel and cobalt release from 200 unused hand-held work tools for sale in Denmark — Sources of occupational metal contact dermatitis?

Jacob P. Thyssen, Peter Jensen, Carola Lidén, Anneli Julander, Morten S. Jellesen, Torkil Menné, Jeanne D. Johansen

Journal:

Science of The Total Environment

Year:

2011

Language:

english

File:

PDF, 387 KB

english, 2011

49

Allergic chromium dermatitis from wearing ‘chromium-free’ footwear

Thyssen, Jacob P., Jellesen, Morten S., Møller, Per, Menné, Torkil, Johansen, Jeanne D.

Journal:

Contact Dermatitis

Year:

2014

Language:

english

File:

PDF, 502 KB

english, 2014

50

Parametric Study of Solder Flux Hygroscopicity: Impact of Weak Organic Acids on Water Layer Formation and Corrosion of Electronics

Piotrowska, Kamila, Ud Din, Rameez, Grumsen, Flemming Bjerg, Jellesen, Morten Stendahl, Ambat, Rajan

Journal:

Journal of Electronic Materials

Year:

2018

Language:

english

File:

PDF, 9.82 MB

english, 2018

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